A: sillicon chip
B: carrier package
C: integrated circuit
D: semiconducto
举一反三
- We can call a chip as __________ A: Silicon chip B: Carrier package C: Integrated circuit D: semiconducto
- We can call a chip as __________
- There are analog-to-digital and digital-to-analog chips, DSP chip, microprocessor chip, ROM and flash memory chips, and other chips on the circuit board.
- Moore's law means _____. A: The power of integrated transistors on a chip doubles every year, and so does its computing power. B: The power of integrated transistors on a chip doubles every two years, and so does its computing power. C: The power of integrated transistors on a chip doubles every 18 months, and so does its computing power; D: The power of integrated transistors on a chip doubles every six months, and so does its computing power.
- We often express chip capacities in word size,word size can be __________.
内容
- 0
Chip scale packaging(CSP) has an IC package that is about the same size as the silicon chip (＜( ) times the footprint of the die)
- 1
Chip scale packaging(CSP) has an IC package that is about the same size as the silicon chip (＜( ) times the footprint of the die) A: 1 B: 1.2 C: 1.5 D: 2
- 2
表面贴装集成电路的封装主要有小外形封装（SOP: Small Outline Package）、塑封有引线芯片封装（PLCC: Plastic Leaded Chip Carrier）、方形扁平封装（QFP: Quad Flat Package）、无引线陶瓷芯片封装（LCCC: Leadless Ceramic Chip Carrier）、 、载带自动键合（TAB：tape automated bonding）、微凸点连接（MBB: Micro-Bump Bonding）等。
- 3
In the circuit , how to realize the change of 163 in counting system? A: 163 chip D0-D3 pin level change, with LD signal B: 163 chip Q0-Q3 pin level change, cooperate with LD pin C: 164 chip QA-QH pin level change, cooperate with CLK D: Clock square wave change
- 4
{A}对应"板上芯片"的元器件封装库是：Plastic Leaded Chip Carrier。