In the circuit , how to realize the change of 163 in counting system? A: 163 chip D0-D3 pin level change, with LD signal B: 163 chip Q0-Q3 pin level change, cooperate with LD pin C: 164 chip QA-QH pin level change, cooperate with CLK D: Clock square wave change

Memory chip could be _____________ A: RAM B: ROM C: microprocessor chip D: flash memory

The high level and low level specified by LVTTL are ________. A: high level 5.0V low level 0V B: high level 3.3V low level 0V C: high level 2.4V~5.0V low level 0V~0.5V D: high level 2.4V~3.3V low level 0V~0.4V

How to make a chip？

We can call a chip as ________. A: sillicon chip B: carrier package C: integrated circuit D: semiconducto

We can call a chip as __________ A: Silicon chip B: Carrier package C: Integrated circuit D: semiconducto

There are analog-to-digital and digital-to-analog chips, DSP chip, microprocessor chip, ROM and flash memory chips, and other chips on the circuit board.

Chip scale packaging(CSP) has an IC package that is about the same size as the silicon chip (＜( ) times the footprint of the die)

We can call a chip as __________

Some parts of metal furniture are most suitable for stamping and bending, which is a typical non chip and less chip processing technology.