以下哪种工艺不适用于制备薄膜材料:() A: HPS B: CVD C: Hydrothermal D: Sol-gel
以下哪种工艺不适用于制备薄膜材料:() A: HPS B: CVD C: Hydrothermal D: Sol-gel
_________is the most promising one to get large area and high-quality 2D materials for the applications of electronics. A: Mechanical exfoliation B: Intercalation and Selective etching C: Hydrothermal D: Chemical vapor deposition (CVD)
_________is the most promising one to get large area and high-quality 2D materials for the applications of electronics. A: Mechanical exfoliation B: Intercalation and Selective etching C: Hydrothermal D: Chemical vapor deposition (CVD)
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